The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Mar. 14, 2000
Randy H. Y. Lo, Taipei, TW;
Jui-Meng Jao, Miaoli, TW;
Abstract
A method is proposed for forming solder areas over a lead frame through deposition of an oxidation layer rather than selective removal of a polyimide-made solder mask, which allows the fabrication of the lead frame to be carried out in a more cost-effective and advantageous manner. The method allows the fabrication of the lead frame to be carried out through stamping without etching. Moreover, it can make the overall integrated circuit package less easily subjected to cracking and more securely assembled. Still moreover, it can make the overall integrated circuit package less likely to be weakened in structural strength by moisture. This method is therefore more advantageous to use than the prior art.