Jui-Hsieh Lai

Title: Innovations of Jui-Hsieh Lai

Introduction

Jui-Hsieh Lai is a prominent inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 8 patents. His work focuses on enhancing the efficiency and reliability of semiconductor devices.

Latest Patents

One of his latest patents is titled "Package structure with underfill." This invention provides a package structure that includes a semiconductor die structure over a substrate, along with bonding structures between the semiconductor die and the substrate. The package structure features multiple solder elements surrounding the semiconductor die structure, with each solder element being longer than a side of the semiconductor die. Additionally, the underfill material is confined within a region surrounded by the solder elements and is in direct contact with at least one of the solder elements. Another notable patent is simply titled "Package structure." This invention includes a waveguide, a passivation layer, and a reflector. The waveguide is positioned over a substrate, while the passivation layer covers the waveguide. The reflector consists of a metal layer and a semiconductor layer that are in contact with the passivation layer.

Career Highlights

Jui-Hsieh Lai is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative work has contributed to advancements in semiconductor technology, making him a valuable asset to his company.

Collaborations

He has collaborated with notable coworkers, including Sung-Hui Huang and Shang-Yun Hou, who have also contributed to the field of semiconductor innovations.

Conclusion

Jui-Hsieh Lai's contributions to semiconductor packaging through his patents demonstrate his expertise and commitment to innovation. His work continues to influence the industry and pave the way for future advancements.