The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2023
Filed:
Jul. 26, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Sung-Hui Huang, Dongshan Township, Yilan County, TW;
Jui-Hsieh Lai, Taoyuan County, TW;
Shang-Yun Hou, Jubei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A package structure is provided. The package structure includes a waveguide, a passivation layer, and a reflector. The waveguide is over a substrate. The passivation layer is over the substrate and covers the waveguide. The reflector includes a metal layer and a semiconductor layer on the passivation layer. The metal layer and the first semiconductor layer are in contact with the passivation layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile