Taiwan Semiconductor Manufacturing Comp. Ltd.

Jui-Hsieh Lai

Shang-Yun Hou

Sung-Hui Huang

Kuan-Yu Huang

Tsung-Yu Chen

Chien-Yuan Huang

Shu-Chia Hsu

Yu-Wei Chen

Yi-Wei Liu

Leu-Jen Chen

A package structure is provided. The package structure includes a semiconductor die structure over a substrate and bonding structures between the semiconductor die and the substrate. The package structure also includes multiple solder elements over the substrate. The solder elements together surround the semiconductor die structure, and each of the solder elements is longer than a side of the semiconductor die structure. The package structure further includes an underfill material surrounding the bonding structures. The underfill material is substantially confined within a region surrounded by the solder elements. The underfill material is in direct contact with at least one of the solder elements.

Package structure with underfill

A package structure is provided. The package structure includes a waveguide, a passivation layer, and a reflector. The waveguide is over a substrate. The passivation layer is over the substrate and covers the waveguide. The reflector includes a metal layer and a semiconductor layer on the passivation layer. The metal layer and the first semiconductor layer are in contact with the passivation layer.

Package structure

A method for forming a package structure is provided. The method includes disposing an optical component and a waveguide over a substrate, forming a passivation layer over the substrate and covering the optical component and the waveguide, and forming a reflector including a metal layer and a first semiconductor layer on the passivation layer, wherein the metal layer and the first semiconductor layer are in contact with the passivation layer.

Method for forming a package structure for optical fiber

A structure and a formation method of a package structure are provided. The method includes forming one or more solder elements over a substrate. The one or more solder elements surround a region of the substrate. The method also includes disposing a semiconductor die structure over the region of the substrate. The method further includes dispensing a polymer-containing liquid onto the region of the substrate. The one or more solder elements confine the polymer-containing liquid to being substantially inside the region. In addition, the method includes curing the polymer-containing liquid to form an underfill material.

Structure and formation method of package structure with underfill

A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

Chip package structure

A method for forming a package structure is provided, including: disposing an optical component and a waveguide over a first substrate; forming a passivation layer over the first substrate and covering the optical component and the waveguide; removing a portion of the passivation layer to form a first opening; and disposing a reflector over the passivation layer, wherein a metal layer of the reflector is formed in the first opening.

Package structure for optical fiber and method for forming the same

A package structure is provided. The package structure includes an optical component over a substrate, and a reflector disposed over the substrate. The reflector includes a first semiconductor layer over a second semiconductor layer, and a dielectric layer between the first semiconductor layer and the second semiconductor layer. The reflector also includes a metal layer between the second semiconductor layer and the substrate. In addition, the package structure includes a waveguide between the metal layer and the optical component.

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Taoyuan County, Taiwan

Jui-Hsieh Lai