Juergen Leib

Title: Innovations by Juergen Leib in Semiconductor Packaging

Introduction

Juergen Leib is a notable inventor based in Freising, Germany. He has made significant contributions to the field of semiconductor packaging, holding a total of 8 patents. His work focuses on innovative methods that enhance the efficiency and effectiveness of electronic device packaging.

Latest Patents

One of Juergen Leib's latest patents is a method for packing semiconductor components. This method involves connecting a first side of a first wafer to at least one further wafer, where at least one of the wafers contains multiple semiconductor circuits. Trenches are created on the second side of the first wafer, which divides it into several parts while maintaining mechanical connections through the additional wafer. The connecting region is laterally exposed in the trenches, allowing for a coating to be applied to protect this area. Another significant patent relates to the packaging of electronic devices and their associated driver and/or controller integrated circuits, focusing on the mechanical packaging of these devices.

Career Highlights

Throughout his career, Juergen Leib has worked with prominent companies such as Schott AG and Wafer-Level Packaging Portfolio LLC. His experience in these organizations has contributed to his expertise in semiconductor technology and packaging solutions.

Collaborations

Juergen Leib has collaborated with notable professionals in his field, including Rainer Liebald and Dietrich Mund. These collaborations have further enriched his work and innovations in semiconductor packaging.

Conclusion

Juergen Leib's contributions to semiconductor packaging through his innovative patents and collaborations highlight his significant role in advancing technology in this field. His work continues to influence the development of efficient electronic devices.