Enter assignee name

% Expired Patents = 100.0

Forward Citations = 20

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6 inventors (with patents filed for the assignee):

Juergen Leib (4 out of 8 patents)

Jürgen Leib (3 out of 16 patents)

Hidefumi Yamamoto (2 out of 3 patents)

4. Dipl-Ing Florian Bieck (2 out of 2 patents)

5. Florian Bieck (1 out of 9 patents)

6. Phil P Marcoux (1 out of 8 patents)

8 patents: Sort by Forward Citations

1. 8420445 - Method for packing semiconductor components and product produced according to the method (2013-04-16),

2. 8399293 - Method for packaging electronic devices and integrated circuits (2013-03-19),

3. 8349707 - Process for making contact with and housing integrated circuits (2013-01-08),

4. 8309384 - Process for packaging components, and packaged components (2012-11-13),

5. 8114304 - Method for producing electronic components (2012-02-14),

6. 8017435 - Method for packaging electronic devices and integrated circuits (2011-09-13),

7. 7880179 - Process for making contact with and housing integrated circuits (2011-02-01),

8. 7858512 - Semiconductor with bottom-side wrap-around flange contact (2010-12-28),

Wafer-level Packaging Portfolio LLC is a leading provider of advanced wafer-level packaging solutions for the semiconductor industry. With a focus on innovation and quality, we offer a comprehensive range of services to meet the packaging needs of our clients. Our state-of-the-art facilities and experienced team ensure that we deliver cutting-edge solutions for the most demanding applications.

Profile summary based on public USPTO records.