This inventor holds 3 USPTO granted patents. Top assignees: Wafer-Level Packaging Portfolio LLC, Sumitomo Chemical Company, Limited. Active years: 1984-2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
2 out of 8 
1 out of 6,964 Years Active: 1984-2013
Title: The Innovations of Hidefumi Yamamoto
Introduction
Hidefumi Yamamoto is a notable inventor based in Takatsuki, Japan. He has made significant contributions to the field of electronic devices, particularly in the area of packaging for integrated circuits. With a total of 3 patents to his name, Yamamoto's work has had a considerable impact on the industry.
Latest Patents
Yamamoto's latest patents focus on methods for packaging electronic devices and integrated circuits. These inventions relate to the mechanical packaging of electronic devices and their associated driver and/or controller integrated circuits. His innovative approaches aim to enhance the efficiency and reliability of electronic device packaging.
Career Highlights
Throughout his career, Yamamoto has worked with prominent companies such as Wafer-Level Packaging Portfolio LLC and Sumitomo Chemical Company, Limited. His experience in these organizations has allowed him to refine his expertise in electronic device packaging.
Collaborations
Yamamoto has collaborated with several professionals in his field, including Juergen Leib and Hideo Hirohara. These partnerships have contributed to the advancement of his projects and innovations.
Conclusion
Hidefumi Yamamoto's contributions to the field of electronic devices and packaging are noteworthy. His patents and collaborations reflect his commitment to innovation and excellence in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile