Ju Pyo Hong

Title: Ju Pyo Hong: Innovator in Semiconductor Packaging Technology

Introduction

Ju Pyo Hong is a prominent inventor based in Gyunggi-do, South Korea. He has made significant contributions to the field of semiconductor packaging technology, holding a total of 7 patents. His work focuses on improving the reliability and efficiency of electronic components through innovative packaging methods.

Latest Patents

One of his latest patents is titled "Stacked Wafer Level Package and Method of Manufacturing the Same." This invention addresses the misalignment issues that can occur during the stacking process of semiconductor chips. By implementing a method that includes bonding internal connection means to a conductive layer before the stacking process, the invention enhances reliability and yield while reducing manufacturing costs. Another notable patent is the "Method of Manufacturing Stacked Wafer Level Package," which outlines a comprehensive process for creating a stacked wafer level package. This method involves several steps, including preparing a substrate, forming a conductive layer, and stacking electronic components to ensure effective electrical connections.

Career Highlights

Ju Pyo Hong is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop innovative solutions in semiconductor technology. His expertise and dedication to research have positioned him as a key figure in his field.

Collaborations

He has collaborated with notable coworkers, including Seung Wook Park and Young Do Kweon, contributing to advancements in semiconductor packaging.

Conclusion

Ju Pyo Hong's contributions to semiconductor packaging technology exemplify the impact of innovation in the electronics industry. His patents not only address critical challenges but also pave the way for future advancements in the field.