The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Jan. 22, 2009
Seung Wook Park, Gyunggi-do, KR;
Young DO Kweon, Seoul, KR;
Jingli Yuan, Gyunggi-do, KR;
Seon Hee Moon, Seoul, KR;
Ju Pyo Hong, Gyunggi-do, KR;
Jae Kwang Lee, Gyunggi-do, KR;
Seung Wook Park, Gyunggi-do, KR;
Young Do Kweon, Seoul, KR;
Jingli Yuan, Gyunggi-do, KR;
Seon Hee Moon, Seoul, KR;
Ju Pyo Hong, Gyunggi-do, KR;
Jae Kwang Lee, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A dual face package includes a semiconductor substrate including a through-electrode connected to a die pad disposed on one side of the semiconductor substrate, and a lower redistribution layer disposed on another side thereof and connected to the through-electrode, an insulating layer including a post electrode connected to the through-electrode, and an upper redistribution layer disposed on one side thereof and connected to the post electrode, and an adhesive layer disposed on the one side of the semiconductor substrate so as to attach the insulating layer to the semiconductor substrate such that the through-electrode is connected to the post electrode.