The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2011
Filed:
Aug. 31, 2009
Shan Gao, Gyunggi-do, KR;
Seog Moon Choi, Seoul, KR;
Tae Hyun Kim, Seoul, KR;
Ju Pyo Hong, Gyunggi-do, KR;
Bum Sik Jang, Gyunggi-do, KR;
Ji Hyun Park, Seoul, KR;
Shan Gao, Gyunggi-do, KR;
Seog Moon Choi, Seoul, KR;
Tae Hyun Kim, Seoul, KR;
Ju Pyo Hong, Gyunggi-do, KR;
Bum Sik Jang, Gyunggi-do, KR;
Ji Hyun Park, Seoul, KR;
Abstract
Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile