Parsberg, Germany

Josef Wittl

USPTO Granted Patents = 16 


Average Co-Inventor Count = 2.9

ph-index = 5

Forward Citations = 90(Granted Patents)


Location History:

  • Regensburg, DE (2005)
  • Parsberg, DE (2002 - 2016)

Company Filing History:


Years Active: 2002-2016

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16 patents (USPTO):

Title: The Innovative Contributions of Josef Wittl

Introduction

Josef Wittl is a prominent inventor based in Parsberg, Germany, known for his significant contributions to the field of wafer-level packaging. With a total of 16 patents to his name, Wittl has made remarkable advancements that enhance the efficiency and cost-effectiveness of electronic device manufacturing.

Latest Patents

Wittl's latest patents focus on methods for performing extended wafer-level packaging (eWLP) and the devices created through these methods. His innovations allow for back side electrical and thermal connections to be made easily and economically at the eWLP wafer level, eliminating the need for complex processes such as thru-mold vias (TMVs) or thru-silicon vias (TSVs). These methods simplify the creation of electrical and optical interfaces on both the front and back sides of the eWLP wafer, enabling the formation of optoelectronic devices with diverse configurations.

Career Highlights

Throughout his career, Josef Wittl has worked with leading companies in the technology sector, including Infineon Technologies AG and Avago Technologies Fiber IP (Singapore) Pte. Ltd. His work has significantly impacted the development of advanced packaging technologies, making him a key figure in the industry.

Collaborations

Wittl has collaborated with notable professionals in his field, including Hans Hurt and Frank Weberpals. These partnerships have contributed to the successful development and implementation of his innovative packaging methods.

Conclusion

Josef Wittl's contributions to wafer-level packaging technology have paved the way for more efficient and cost-effective manufacturing processes in the electronics industry. His patents and collaborations reflect his commitment to innovation and excellence in engineering.

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