The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2008

Filed:

Jul. 27, 2005
Applicants:

Albert Auburger, Regenstauf, DE;

Hans Hurt, Regensburg, DE;

Stefan Paulus, Zeitlarn, DE;

Nikolaus Schunk, Maxhutte-Haidhof, DE;

Frank Weberpals, Regensburg, DE;

Josef Wittl, Parsberg, DE;

Inventors:

Albert Auburger, Regenstauf, DE;

Hans Hurt, Regensburg, DE;

Stefan Paulus, Zeitlarn, DE;

Nikolaus Schunk, Maxhutte-Haidhof, DE;

Frank Weberpals, Regensburg, DE;

Josef Wittl, Parsberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.


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