Infineon Technologies Ag

Avago Technologies Fiber IP (singapore) Pte. Ltd

Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies General IP Pte, Ltd.

Avago Technologies Fiber IP Pte Ltd.

Josef Wittl

Hans Hurt

Frank Weberpals

Nikolaus W Schunk

Hans-Ludwig Althaus

Martin Weigert

Thomas Killer

Detlef Bernd Krabe

Gustav M&uuml;ller

Stephan Prucker

Gottfried Beer

Karl Schrödinger

Stefan Paulus

Albert Auburger

Thomas Lichtenegger

Elmar Baur

Gunther Steinle

Hans Ludwig Althaus

Alfred Hartl

Gustav Müller

Tobias Stäber

Tobias Bitter

Joachim Pfeiffer

Hans Althaus

Nikolaus Schunk

Embedded Wafer-Level Packaging (eWLP) devices, packages and assemblies and methods of making them are provided. The eWLP methods allow back side electrical and/or thermal connections to be easily and economically made at the eWLP wafer level without having to use thru-mold vias (TMVs) or thru-silicon vias (TSVs) to make such connections. In order to create TMVs, processes such as reactive ion etching or laser drilling followed metallization are needed, which present difficulties and increase costs. In addition, the eWLP methods allow electrical and optical interfaces to be easily and economically formed on the front side and/or on the back side of the eWLP wafer, which allows the eWLP methods to be used to form optoelectronic devices having a variety of useful configurations.

Methods for performing extended wafer-level packaging (eWLP) and eWLP devices made by the methods

Methods are provided for making embedded Wafer-Level Packaging (eWLP) devices, packages and assemblies. The eWLP methods allow back side electrical and/or thermal connections to be easily and economically made at the eWLP wafer level without having to use thru-mold vias (TMVs) or thru-silicon vias (TSVs) to make such connections. In order to create TMVs, processes such as reactive ion etching or laser drilling followed metallization are needed, which present difficulties and increase costs. In addition, the eWLP methods allow electrical and optical interfaces to be easily and economically formed on the front side and/or on the back side of the eWLP wafer, which allows the eWLP methods to be used to form optoelectronic devices having a variety of useful configurations.

An optical connector is provided having a housing with a cavity formed therein through which an optical fiber passes. Within the cavity, a slightly bent, unjacketed portion of the core of the optical fiber is disposed. If conditions are such that pistoning of the core begins to occur, the slightly bent, unjacketed portion of the core straightens, thereby causing the end of the core to remain substantially flush with the end of the ferrule of the connector housing. In this way, the pistoning effect at the end of the fiber is prevented and optical losses associated with the occurrence of the pistoning effect are avoided.

Optical connector that compensates for longitudinal shifting of optial fiber core relative to a housing of the connector, and a method

The invention relates to a method and a device for operating an optical transmitting device having a plurality of optical transmitters that can be driven independently. The method includes detecting the parameter values of the individual transmitters, comparing the parameter values determined with one another and/or with a prescribed comparison value, and selecting one of the transmitters for the communication operation of the transmitting device based on the comparison. The method further includes operating the transmitting device with the selected transmitter.

Method and device for operating an optical transmitting device having a plurality of optical transmitters that can be driven independently

The invention relates to an electro-optical data transmission arrangement with an optical multicore fiber, on the respective end faces of which an electro-optical transducer is arranged, wherein at least one of the electro-optical transducers consists of several segments. The electro-optical data transmission arrangement allows high data transmission rates and broad tolerances in the manufacture.

Electro-optical data transmission arrangement, as well as method for its configuration

Various embodiments of arrangements for optically coupling an optical waveguide to an optical unit of an optical module are provided. One embodiment is an optical module for optically coupling an optical waveguide to an optical unit. One such optical module comprises: a reference structure having a reference geometry that defines a first axis of symmetry; an optical unit having an optical axis along which light is transmitted or received, the optical unit positioned relative to the reference structure with an offset between the first axis of symmetry and the optical axis; and a coupling element that couples the optical unit to an optical waveguide, the coupling element having an eccentric hole which functions as a fiber guide and a structural geometry adapted to compensate for the offset between the first axis of symmetry and the optical axis.

Arrangement for optically coupling an optical waveguide to an optical unit of an optical module and coupling element for such an arrangement

A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.

Method for producing an optical or electronic module provided with a plastic package

An optoelectronic transmission and/or reception arrangement with an optical unit having a transmission component and/or a reception component, an electrical circuitry component for the transmission component and/or the reception component, a circuit carrier, on which the components are mounted and contact-connected, and a coupling part for receiving and coupling at least one optical fiber which can be optically coupled to the transmission component and/or the reception component. The electrical contact-connection of the circuit carrier is effected via the coupling part.

Optoelectronic transmission and/or reception arrangement

Optoelectronic transmission and/or reception arrangements having a surface-mounted optoelectronic component and a circuit board provided with electrical lines, the optoelectronic component being surface-mounted on said circuit board, the optical axis of the optoelectronic component running perpendicular to the plane of the circuit board. In one embodiment, provision is made of a holding apparatus for receiving and orienting an optical waveguide to be coupled to the optoelectronic component, which holding apparatus directly adjoins the side of the optoelectronic component that is remote from the circuit board. In another embodiment, the circuit board has a cutout and light is coupled into or out of the optoelectronic component in the direction of the cutout of the circuit board.

Optoelectronic transmission and/or reception arrangements

In a modular system of optoelectronic components each component has a standardized housing. The standard housing has a device for the mechanical connection to at least one housing of a further component, or it is connected to such a device. This allows different combinations to be produced using the same system components. Flat optoelectronic components are particularly suitable for use in the modular system. In this case, according to the invention, an optical waveguide is integrated in the component, runs parallel to a circuit mount, and forms an optical interface on one narrow housing face. The electrical contacts of the component are likewise arranged on a narrow housing face.

Modular system of optoelectronic components, and optoelectronic component for use in such a system

An optoelectronic transmitting and/or receiving module and an optical plug include a circuit carrier disposed at least partially in an alignment parallel to the optical axis of the module in a module housing. The circuit carrier forms a tongue-shaped region that protrudes into the continuation. A transmitting device and/or a receiving device is disposed in the continuation, where they are connected to the circuit carrier. The associated axial offsetting of the transmitting device and/or receiving device in the direction of an optical plug to be coupled on permits the provision of plug-in connections with improved protection of the devices and the fiber ends.

Optoelectronic transmitting and/or receiving module, circuit carrier, module housing, and optical plug

The opto-electronic assembly receiving optical signals. Two detectors, each with an optically active area, convert optical signals into electrical signals. Two of the detectors are arranged on each other, and the optically active area of one detector is shielded. The opto-electronic assembly receives the optical signals and detects interference signals reliably. The assembly requires little space within an opto-electronic structure and can be produced simply and cost-effectively.

OPTO-electronic assembly having detectors for converting optical signals

The invention relates to a receiving and coupling part for an optoelectronic transmission and/or reception element having an opening for inserting a carrier on which the transmission and/or reception element is disposed, having a casting material that surrounds the transmission and/or reception element, and having a coupling region for the coupling of an optical fiber. The receiving and coupling part includes a cylindrical recess, one end of which contains the transmission and/or reception element, and the other end of which serves for the receiving and coupling of an optical fiber. The receiving and coupling part makes possible the arranging of the transmission and/or reception element in a transparent casting compound and the coupling of an optical fiber in a simple manner and exhibits a high degree of stability with respect to temperature fluctuations.

Receiving and coupling part for opto-electronic transmission and/or reception element

An electrooptical transmitting and/or receiving module has a lead frame and an optoelectronic transducer mounted thereon. The lead frame and the optoelectronic transducer are potted by a shaped body made from transparent, formable material. Introduced into the shaped body is a reflector element. A radiation beam emitted by a transmitter, or a received radiation beam to be directed onto a receiver is deflected at a prescribed angle by the reflector element. The module can be used in an electrooptical transmitting and/or receiving unit which is constructed as a sidelooker. A method is also provided for molding the electrooptical transmitting and/or receiving module.

Electrooptical transmitting/receiving module, and method for producing the module

A module essentially includes a module housing, into which is introduced a lead frame. An electro-optical transducer is mounted on the lead frame. The interior of the module housing is filled with a transparent potting compound. A plug receptacle part is moulded onto the outer housing wall and has a defined outer contour. Situated in the interior of the plug receptacle part is an optical waveguide piece, which proceeding from the surroundings of an outer area of the plug receptacle part, extends through the interior of the plug receptacle part and through a housing opening right into the housing interior. The optical waveguide piece is optically coupled to the electro-optical transducer. An optical waveguide plug interacting with the module has a sleeve-shaped plug section corresponding to the plug receptacle part.

Growing community of inventors

Parsberg, Germany

Josef Wittl