Joonseok Oh

Title: Joonseok Oh: Innovator in Semiconductor Technology

Introduction

Joonseok Oh is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative semiconductor packaging solutions that enhance performance and reliability.

Latest Patents

One of Joonseok Oh's latest patents is a semiconductor package that includes at least one first rewiring structure. This structure consists of multiple first insulating layers stacked vertically, along with several first rewiring patterns. The design incorporates at least one semiconductor chip and a molding layer that covers the chip. Each rewiring pattern features a first conductive pattern with a curved upper surface and a first seed pattern that covers both the side and lower surfaces of the conductive pattern. Notably, all first seed patterns share the same shape.

Another significant invention is the fan-out semiconductor package. This package includes a frame with insulating layers and a penetration portion. A semiconductor chip is positioned within this penetration, featuring a connection pad. The design also includes a connection structure with a redistribution layer, along with encapsulants that cover various surfaces of the semiconductor chip and frame. This innovative approach aims to improve the efficiency and functionality of semiconductor devices.

Career Highlights

Joonseok Oh is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the company's reputation for innovation.

Collaborations

Throughout his career, Joonseok Oh has collaborated with talented individuals such as Changbo Lee and Byunglyul Park. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Joonseok Oh is a notable inventor whose work in semiconductor packaging has led to several innovative patents. His contributions to Samsung Electronics Co., Ltd. and collaborations with esteemed colleagues highlight his commitment to advancing technology in the semiconductor field.