The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Feb. 23, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Giseung Heo, Suwon-si, KR;
Seonkyu Kim, Suwon-si, KR;
Joonseok Oh, Suwon-si, KR;
Kyunghee Lee, Suwon-si, KR;
Junghyun Cho, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes; a first redistribution structure, a chip disposed on the first redistribution structure, and a package body disposed on the first redistribution structure and covering opposing side surfaces of the chip. The first redistribution structure includes; a vertically stacked plurality of redistribution layers, a respectively intervening plurality of passivation layers insulating the plurality of redistribution layers, and a plurality of redistribution vias penetrating the plurality of passivation layers to electrically connect redistribution layers among the plurality of redistribution layers, wherein each passivation layer among the plurality of passivation layers includes a diffusion barrier layer formed on a corresponding redistribution layer among the plurality of redistribution layers, and a warpage control layer formed on the diffusion barrier layer.