This inventor holds 7 USPTO granted patents. Top assignee: Intel Corporation. Active years: 1997-2010.
Company Filing History:
Years Active: 1997-2010
Title: Joni G Hansen: Innovator in Electronic Assembly Technologies
Introduction
Joni G Hansen is a prominent inventor based in Phoenix, AZ (US). She has made significant contributions to the field of electronic assemblies, particularly in the area of thermal management. With a total of 7 patents to her name, Hansen's work has had a substantial impact on the efficiency and performance of integrated circuit packages.
Latest Patents
Hansen's latest patents include innovative technologies related to electronic assemblies with hot spot cooling. One of her notable inventions involves a composite of two or more thermal interface materials (TIMs) placed between a die and a heat spreader. This design aims to improve the cooling of the die in an integrated circuit package. The TIMs vary in heat-dissipation capability depending on the locations of die hot spots. In one embodiment, a more thermally conductive material is positioned over one or more die hot spots, while a less thermally conductive material surrounds it. The TIMs may consist of a solder and a polymer, and the composite TIM can be preformed as a single unit or multiple units. Methods of fabrication and applications of the package to electronic assemblies and systems are also described in her patents.
Career Highlights
Joni G Hansen is currently employed at Intel Corporation, where she continues to innovate and develop new technologies. Her work at Intel has allowed her to collaborate with other talented professionals in the field, further enhancing her contributions to electronic assembly technologies.
Collaborations
Some of her notable coworkers include Carl L Deppisch and Debendra Mallik, who have also made significant contributions to the field. Their collaborative efforts have helped advance the development of innovative solutions in electronic assemblies.
Conclusion
Joni G Hansen is a trailblazer in the realm of electronic assembly technologies, with a focus on improving thermal management in integrated circuits. Her innovative patents and work at Intel Corporation highlight her dedication to advancing technology in this critical field.