The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2010
Filed:
Dec. 08, 2008
Fay Hua, Fremont, CA (US);
Carl L. Deppisch, Chandler, AZ (US);
Joni G. Hansen, Phoenix, AZ (US);
Youzhi E Xu, Gilbert, AZ (US);
Fay Hua, Fremont, CA (US);
Carl L. Deppisch, Chandler, AZ (US);
Joni G. Hansen, Phoenix, AZ (US);
Youzhi E Xu, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A composite of two or more thermal interface materials ('TIMs') is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.