Jong-Joo Lee

This inventor holds 22 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2006-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jong-Joo Lee. Retrieved from https://idiyas.com/inventor/jong-joo-lee-7142sr7v

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 22

% Patents Active = 86.4

Average Co-Inventor Count = 1.5

ph-index = 7

Forward Citations = 377(Granted Patents)

Location History:

Kyungki-do, KR (2006)
Suwon, KR (2007)
Gyeonggi-do, KR (2008 - 2014)
Hwaseong-si, KR (2019 - 2021)

Company Filing History:

22 out of 132,108

Samsung Electronics Co., Ltd.

patents

Years Active: 2006-2021

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Areas of Expertise:

Semiconductor Package

Multi-Chip Ball Grid Array

Power Distribution

High I/O Chip Package

Redistribution Pattern

Conductive Bump

Circuit Board

Chip Stack Package

Planar Multi Semiconductor

Thermal Management

Manufacturing Method

22 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10971486 - Semiconductor package and method of manufacturing the semiconductor package (2021-04-06),

2. 10461033 - Semiconductor memory package (2019-10-29),

3. 10381334 - Semiconductor package and method of manufacturing the semiconductor package (2019-08-13),

4. 8643178 - Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same (2014-02-04),

5. 8410611 - Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same (2013-04-02),

6. 8319351 - Planar multi semiconductor chip package (2012-11-27),

7. 8319324 - High I/O semiconductor chip package and method of manufacturing the same (2012-11-27),

8. 8120176 - Semiconductor device having a conductive bump (2012-02-21),

9. 8115315 - Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same (2012-02-14),

10. 8061024 - Method of fabricating a circuit board and semiconductor package. (2011-11-22),

11. 8044302 - Printed circuit board having coplanar LC balance (2011-10-25),

12. 8039928 - Chip stack package (2011-10-18),

13. 7768115 - Stack chip and stack chip package having the same (2010-08-03),

14. 7745922 - Package board having internal terminal interconnection and semiconductor package employing the same (2010-06-29),

15. 7675181 - Planar multi semiconductor chip package and method of manufacturing the same (2010-03-09),

Title: Innovations of Jong-Joo Lee in Semiconductor Technology

Introduction

Jong-Joo Lee, a prominent inventor based in Gyeonggi-do, South Korea, has made significant contributions to the field of semiconductor technology. With a total of 22 patents to his name, his work continues to push the boundaries of innovation within the industry.

Latest Patents

Among his latest patents is the "Semiconductor package and method of manufacturing the semiconductor package." This innovative package design features a substrate with multiple conductive pads, a capacitor structure integrated on the upper surface, and first semiconductor chips that are electrically connected to the substrate pads. Another notable patent is the "Semiconductor memory package," which comprises a base substrate with defined chip and external connection pads. This invention allows for efficient electrical paths between the external connection and semiconductor memory chips, enhancing overall performance in memory applications.

Career Highlights

Jong-Joo Lee works at Samsung Electronics Co., Ltd., a leading company in the global electronics market. His role at Samsung has afforded him the platform to develop and patent groundbreaking semiconductor technologies that address the evolving needs of modern electronic devices. His patents not only offer innovative solutions but also secure his reputation as a key innovator in the industry.

Collaborations

Throughout his career, Jong-Joo Lee has collaborated with talented individuals such as Dong-Ho Lee and Seung-Duk Baek. These collaborations have led to the successful development of several patents, showcasing the importance of teamwork in complex technological advancements.

Conclusion

Jong-Joo Lee's dedication to innovation in semiconductor technology is evident through his numerous patents and contributions at Samsung Electronics Co., Ltd. His work continues to influence the electronics industry, paving the way for future advancements in semiconductor design and manufacturing. As a recognized inventor, Jong-Joo Lee exemplifies the spirit of innovation essential in today’s technological landscape.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]