The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2011
Filed:
May. 23, 2008
Jong-joo Lee, Gyeonggi-do, KR;
Soon-yong Hur, Gyeonggi-do, KR;
Jong-Joo Lee, Gyeonggi-do, KR;
Soon-Yong Hur, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Maetan-dong, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
Provided are a circuit board, a semiconductor package including the circuit board, a method of fabricating the circuit board, and a method of fabricating the semiconductor package. The method of fabricating the circuit board includes: forming at least one pair of rows of first bonding pads arranged on a base substrate in a first direction, and a first central plating line formed between the rows of first bonding pads to commonly connect with the rows of first bonding pads; forming an electroplating layer on the first bonding pads; and exposing the base substrate by removing the first central plating line.