The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2012
Filed:
Dec. 05, 2007
Jong-joo Lee, Gyeonggi-do, KR;
Jong-Joo Lee, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
Provided are a high I/O semiconductor chip package in which a processor and a memory device are connected to each other via through electrodes and a method of manufacturing the high I/O semiconductor chip package. The high I/O semiconductor chip package includes: a substrate comprising a plurality of first circuit patterns on a first surface and a plurality of second circuit patterns on a second surface; a first semiconductor chip comprising a plurality of memory devices arranged on the substrate, each memory device being arranged in a matrix in chip regions partitioned by a scribe region; a second semiconductor chip stacked on the first semiconductor chip; and a plurality of through electrodes arranged along peripheral portions of the memory devices and connecting the first and second semiconductor chips to the second circuit patterns of the substrate.