Jon Reid

Title: Jon Reid: Innovator in Electroplating Solutions

Introduction

Jon Reid is a notable inventor based in Sherwood, Oregon, who has made significant contributions to the field of electroplating. With a total of 4 patents to his name, Reid has focused on developing innovative solutions that enhance the efficiency and effectiveness of electroplating processes.

Latest Patents

Reid's latest patents include advancements in low copper electroplating solutions for fill and defect control. Certain embodiments of this invention relate to a method of electroplating copper into damascene features using a low copper concentration electrolyte, which contains less than about 10 g/L copper ions and about 2-15 g/L acid. This low copper electrolyte produces a relatively high overpotential on the plating substrate surface, allowing for a slow plating process with minimal fill defects. Additionally, the low copper electrolyte may exhibit a relatively high cloud point. Another significant patent focuses on the deposit morphology of electroplated copper. This invention provides improved methods and devices for electroplating copper on a wafer, involving the pre-treatment of the wafer with a solution containing accelerator molecules. The pre-treatment results in a reduction in roughness of the electroplated copper surface, particularly during the initial phases of copper growth.

Career Highlights

Throughout his career, Jon Reid has worked with various companies, including Novellus Systems Incorporated. His work has been instrumental in advancing electroplating technologies, making him a respected figure in the industry.

Collaborations

Reid has collaborated with notable professionals in his field, including Steven T Mayer and Richard N Hill. These collaborations have contributed to the development of innovative electroplating solutions.

Conclusion

Jon Reid's contributions to electroplating technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations in electroplating solutions.