The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Dec. 18, 2003
Eric Webb, Salem, OR (US);
Jon Reid, Sherwood, OR (US);
Yuichi Takada, Tualatin, OR (US);
Timothy Archer, Lake Oswego, OR (US);
Eric Webb, Salem, OR (US);
Jon Reid, Sherwood, OR (US);
Yuichi Takada, Tualatin, OR (US);
Timothy Archer, Lake Oswego, OR (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
The present invention provides improved methods and devices for electroplating copper on a wafer. Some implementations of the present invention involve the pre-treatment of the wafer with a solution containing accelerator molecules. Preferably, the bath into which the wafer is subsequently placed for electroplating has a reduced concentration of accelerator molecules. The pre-treatment causes a reduction in roughness of the electroplated copper surface, particularly during the initial phases of copper growth.