The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Jan. 29, 2013
Applicant:
Novellus Systems, Inc., Fremont, CA (US);
Assignee:
Novellus Systems, Inc., Fremont, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 7/12 (2006.01); C25D 5/10 (2006.01); C25D 5/48 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01); C25D 17/00 (2006.01); C25D 21/12 (2006.01);
U.S. Cl.
CPC ...
C25D 7/123 (2013.01); C25D 3/38 (2013.01); C25D 5/10 (2013.01); C25D 5/48 (2013.01); H01L 21/2885 (2013.01); H01L 21/76877 (2013.01); C25D 17/001 (2013.01); C25D 21/12 (2013.01);
Abstract
Certain embodiments herein relate to a method of electroplating copper into damascene features using a low copper concentration electrolyte having less than about 10 g/L copper ions and about 2-15 g/L acid. Using the low copper electrolyte produces a relatively high overpotential on the plating substrate surface, allowing for a slow plating process with few fill defects. The low copper electrolyte may have a relatively high cloud point.