John Pierre McCormick

This inventor holds 25 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Lsi Logic Corporation. Active years: 1995-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John Pierre McCormick. Retrieved from https://idiyas.com/inventor/john-pierre-mccormick

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 (Patent Applications = 1)

% Patents Active = 100.0

Average Co-Inventor Count = 1.6

ph-index = 16

Forward Citations = 809(Granted Patents)

Location History:

Redwood, CA (US) (1997)
Redwood City, CA (US) (1995 - 2001)
Palo Alto, CA (US) (1999 - 2006)

Company Filing History:

25 out of 3,715

Lsi Logic Corporation

patents

Years Active: 1995-2006

Loading Chart...

Areas of Expertise:

Multi Chip Module Assembly

Integrated Circuit Package

Solder Balls

Heat Spreader

Die Clip Assembly

Wafer Probe Card

Tab Tape

Power Plane

Thermal Management

Structural Support

Electrolytic Contact Pads

Integrated Heat Spreader

25 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7041516 - Multi chip module assembly (2006-05-09),

2. 6943446 - Via construction for structural support (2005-09-13),

3. 6777314 - Method of forming electrolytic contact pads including layers of copper, nickel, and gold (2004-08-17),

4. 6706622 - Bonding pad interface (2004-03-16),

5. 6558978 - Chip-over-chip integrated circuit package (2003-05-06),

6. 6431432 - Method for attaching solderballs by selectively oxidizing traces (2002-08-13),

7. 6369448 - Vertically integrated flip chip semiconductor package (2002-04-09),

8. 6294840 - Dual-thickness solder mask in integrated circuit package (2001-09-25),

9. 6171888 - Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same (2001-01-09),

10. 6166434 - Die clip assembly for semiconductor package (2000-12-26),

11. 6008991 - Electronic system including packaged integrated circuits with heat (1999-12-28),

12. 6002171 - Integrated heat spreader/stiffener assembly and method of assembly for (1999-12-14),

13. 5909057 - Integrated heat spreader/stiffener with apertures for semiconductor (1999-06-01),

14. 5898575 - Support assembly for mounting an integrated circuit package on a surface (1999-04-27),

15. 5854085 - Multi-layer tab tape having distinct signal, power and ground planes, (1998-12-29),

Title: John Pierre McCormick: Pioneering Inventor from Palo Alto

Introduction: John Pierre McCormick is a distinguished inventor based in Palo Alto, California, known for his groundbreaking contributions to various technological fields.

Latest Patents: McCormick holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his versatility and innovative spirit.

Career Highlights: With a career spanning over two decades, McCormick has worked with leading tech companies in Silicon Valley, spearheading projects that have revolutionized the industry.

Collaborations: Throughout his career, McCormick has collaborated with top researchers, engineers, and scientists, fostering a culture of innovation and excellence in all his projects.

Conclusion: John Pierre McCormick's relentless pursuit of innovation and his passion for creating cutting-edge solutions have solidified his reputation as a trailblazing inventor in the tech world.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: