Santa Clara, CA, United States of America

John Kim

USPTO Granted Patents = 10 

Average Co-Inventor Count = 1.7

ph-index = 3

Forward Citations = 26(Granted Patents)


Company Filing History:


Years Active: 2001-2023

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10 patents (USPTO):Explore Patents

Title: Innovations of John Kim in Semiconductor Packaging

Introduction

John Kim is a prominent inventor based in Santa Clara, CA, known for his significant contributions to the field of semiconductor packaging. With a total of 10 patents to his name, Kim has developed innovative solutions that enhance the efficiency and cost-effectiveness of semiconductor component handling.

Latest Patents

One of Kim's latest patents is focused on tape carrier assemblies that incorporate an integrated adhesive film. This invention aims to improve efficiency and reduce costs in the handling, transport, or storage of semiconductor components. The carrier tape assembly features an adhesive film that is affixed to an elongated and/or extruded carrier tape. The adhesive film is integrally laminated onto the top surface of the carrier tape as a single continuous sheet. This design allows the adhesive film to conform to the top surface of the carrier tape, including any punched cavities for holding semiconductor components. The securement of these components relies heavily on the adhesive properties of the materials used in the adhesive film.

Career Highlights

Throughout his career, John Kim has worked with notable companies such as Micron Technology Incorporated and Daewon Semiconductor Packaging Industrial Company. His experience in these organizations has contributed to his expertise in semiconductor packaging technologies.

Collaborations

Some of Kim's coworkers include Wayne Frederick Ellis and Sunna Chung, who have collaborated with him on various projects in the semiconductor field.

Conclusion

John Kim's innovative work in semiconductor packaging has led to advancements that benefit the industry significantly. His patents reflect a commitment to improving the efficiency and reliability of semiconductor component handling.

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