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For the Inventor, By the Inventor

Scottsdale, AZ, United States of America

John Baird

This inventor holds 17 USPTO granted patents. Top assignee: Motorola Corporation. Active years: 1986-1997.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John Baird. Retrieved from https://idiyas.com/inventor/john-baird

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17

% Patents Active = 100.0

Average Co-Inventor Count = 1.4

ph-index = 9

Forward Citations = 444(Granted Patents)


Company Filing History:

goldMedal17 out of 20,290 
 
Motorola Corporation
 patents

Years Active: 1986-1997

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17 patents (USPTO):Explore Patents
1. 5639695 - Low-profile ball-grid array semiconductor package and method (1997-06-17),
2. 5541450 - Low-profile ball-grid array semiconductor package (1996-07-30),
3. 5535510 - Plastic encapsulated microelectronic device and method (1996-07-16),
4. 5523629 - Plastic encapsulated microelectronic device (1996-06-04),
5. 5397917 - Semiconductor package capable of spreading heat (1995-03-14),
6. 5378928 - Plastic encapsulated microelectronic device and method (1995-01-03),
7. 5252783 - Semiconductor package (1993-10-12),
8. 5139728 - Method of using molding pot having configured bottom (1992-08-18),
9. 5123826 - Molding pot having configured bottom (1992-06-23),
10. 5118271 - Apparatus for encapsulating a semiconductor device (1992-06-02),
11. 5059105 - Resilient mold assembly (1991-10-22),
12. 5040965 - Molding handling aid (1991-08-20),
13. 4996170 - Molding process for encapsulating semiconductor devices using a (1991-02-26),
14. 4910581 - Internally molded isolated package (1990-03-20),
15. 4753160 - Mold press force equalizer (1988-06-28),

Title: Innovations of John Baird in Semiconductor Technology

Introduction

John Baird is a prominent inventor based in Scottsdale, AZ, known for his significant contributions to semiconductor technology. With a total of 17 patents to his name, Baird has made remarkable advancements in the field, particularly in the design and functionality of ball-grid array (BGA) semiconductor packages.

Latest Patents

Among his latest patents is the innovative low-profile ball-grid array semiconductor package and method. This invention features a substrate attached to a support substrate, which includes an opening extending from the upper surface to the lower surface. An integrated circuit chip is securely attached within this opening, with bond pads on the chip electrically connected to ball pads on the substrate's lower surface. Conductive solder balls are then attached to these ball pads. The support substrate plays a crucial role by providing a low profile and acting as a standoff, which limits the collapse of the conductive solder balls when the BGA semiconductor package is mounted onto an application board.

Career Highlights

John Baird has had a distinguished career at Motorola Corporation, where he has been instrumental in developing cutting-edge semiconductor technologies. His work has not only advanced the capabilities of electronic devices but has also set new standards in the industry.

Collaborations

Throughout his career, Baird has collaborated with talented individuals such as Denise M Ommen and Samuel Anderson. These partnerships have fostered a creative

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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