The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 1990
Filed:
Dec. 27, 1988
Applicant:
Inventor:
John Baird, Scottsdale, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 72 ; 357 81 ;
Abstract
A semiconductor package having an internally isolated die flag form an externally exposed heatsink is provided by using a two stage molding process. The first molding stage provides a uniform layer of molding material of a predetermined thickness between a die flag area and a heatsink area. A second stage molding procedure then provides the packaging encapsulation thereby establishing the outer dimensions.
Baird, John. (1990). Internally molded isolated package (U.S. Patent No. 4910581). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4910581
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile