The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 1991
Filed:
Jul. 30, 1990
John Baird, Scottsdale, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An improved molding process utilizes a thixotropic compound. The thixotropic compound is transferred from a feed pot to a manifold having at least one outlet. The manifold is held at a temperature in which the thixotropic compound is not cured. The manifold is engaged with a mold that has an inlet opening that runs to a mold cavity, such that the outlet of the manifold and the inlet of the mold communicate with each other. The thixotropic compound is transferred from the manifold into the mold cavity, which is held at a temperature at which the thixotropic compound is cured. The manifold and the mold are then separated, drawing the thixotropic compound near the exit of the feed runners into the manifold, thus making a clean separation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile