The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 1992

Filed:

Feb. 22, 1991
Applicant:
Inventors:

John Baird, Scottsdale, AZ (US);

James H Knapp, Gilbert, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ;
U.S. Cl.
CPC ...
425116 ; 425127 ;
Abstract

An elastic material covering an outer surface of a cavity plate but not covering any clamping surfaces of the cavity plate or the inner surface of the cavity plate is used to eliminate use of a dam bar in a lead frame. In an embodiment in accordance with the present invention the elastic material provides a supplementary seal to the clamping surfaces of the cavity plate and a primary seal in spaces between leads of the encapsulated lead frame. In a method of using the present invention, the elastic material is placed between the mold base and the cavity plate. A semiconductor lead frame to be encapsulated is placed in cavities provided by the cavity plate. The mold is closed so that clamping surfaces of the cavity plate clamp directly onto the leads. The elastic material deforms under pressure to compensate for any dimensional variations of the mold plates or lead frame and completely seals the space between leads.


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Baird, John. (1992). Apparatus for encapsulating a semiconductor device (U.S. Patent No. 5118271). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5118271

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