Johannes Oonk

Title: Innovations of Johannes Oonk

Introduction

Johannes Oonk is a notable inventor based in Enschede, Netherlands. He has made significant contributions to the field of substrate bonding and electrically conductive vias. With a total of 4 patents, his work showcases innovative methods that enhance the functionality of various materials.

Latest Patents

One of his latest patents is a method for forming an electrically conductive via in a substrate. This method involves several steps, including forming a through hole in a first substrate and bringing a second substrate into contact with it. The process includes filling the hole with an electrically conductive material through electroplating, ensuring that the surfaces of both substrates have a surface roughness of less than 2 nm. Another significant patent is related to bonding two substrates using an intermediate thin film metal layer. This method provides a robust bonding solution for materials such as glass, silicon, and aluminum.

Career Highlights

Johannes Oonk has worked with reputable organizations, including Micronit Microfluidics B.V. and Universiteit Leiden. His experience in these institutions has allowed him to develop and refine his innovative techniques in substrate bonding and conductive materials.

Collaborations

Some of his notable coworkers include Marko Theodoor Blom and Marinus Bernardus Olde Riekerink. Their collaboration has contributed to the advancement of technologies in their respective fields.

Conclusion

Johannes Oonk's contributions to the field of substrate technology and his innovative patents reflect his expertise and dedication as an inventor. His work continues to influence advancements in material bonding and conductive applications.