Micronit Microfluidics B.v.

Universiteit Leiden

Ce-mate B.v.

Medimate Holding B.v.

Johannes Oonk

Marko Theodoor Blom

Marinus Bernardus Olde Riekerink

Ronny Van 't Oever

Jeroen Haneveld

Peter Tijssen

Amitava Gupta

Jean-Christophe Roulet

Jean-Noël Fehr

Steven Selwyn Staal

Jan Floris

Elwin Xander Vrouwe

Michael Keith Richardson

Hendrik Jan Hildebrand Tigelaar

Eric Marijn Wielhouwer

A method for forming an electrically conductive via in a substrate that includes the steps of: forming a through hole in a first substrate; bringing a first surface of a second substrate into contact with the first surface of the first substrate, such that the through hole in the first substrate is covered by the first surface of the second substrate; filling the through hole in the first substrate with an electrically conductive material by electroplating to form the electrically conductive via, and removing the second substrate, wherein the first surface of the first and the second substrate each have a surface roughness Rof less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and the first surface of the first and the second substrate are brought in direct contact with each other, such that a direct bond is formed there between.

Method for forming an electrically conductive via in a substrate

The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.

Method of bonding two substrates and device manufactured thereby

Measurement device () for taking a liquid sample, comprising: a measurement portion () with a measurement surface (), for being in use contacted with the liquid surface and a plug portion () having a plurality of electrical contacts (), wherein the plug portion () is mountable to a socket () of a measurement evaluation apparatus ().

Test chip with plug for measuring the concentration of an analyte in a liquid, housing for test chip and socket for plug

A biological microfluidics chip comprising a substrate, a microfluidic inlet port defining an opening in a surface of the substrate, and a microfluidic outlet port defining an opening in a surface of the substrate. The biological microfluidics chip also comprises a plurality of wells extending from a top surface of the substrate, wherein each well is bounded by one or more walls, and an inlet opening and an outlet opening are provided in a wall of each of the plurality of wells. An inlet microfluidic channel is provided in the substrate to connect the microfluidic inlet port to each of the inlet openings in the walls of the wells, and an outlet microfluidic channel is provided in the substrate to connect each of the outlet openings in the walls of the wells to the microfluidic outlet port.

Biological microfluidics chip and related methods

Growing community of inventors

Enschede, Netherlands

Johannes Oonk