Joanna Dziewiszek

Title: The Innovative Contributions of Joanna Dziewiszek in Electroplating Technology

Introduction

Joanna Dziewiszek, an accomplished inventor based in Boxborough, MA, has made significant advancements in the field of electroplating. With a portfolio of eight patents, her contributions focus on developing methods that enhance the efficiency and effectiveness of electroplating processes, particularly in the production of photoresist defined features.

Latest Patents

One of Dziewiszek's recent patents is titled "Method of Electroplating Photoresist Defined Features from Copper Electroplating Baths Containing Reaction Products of Pyrazole Compounds and Bisepoxides." This innovative technique enables the plating of features with a substantially uniform morphology, utilizing copper electroplating baths that incorporate reaction products to achieve precise and reliable results.

Another noteworthy patent is the "Method of Filling Through-Holes to Reduce Voids and Other Defects." This method describes a direct current plating procedure that effectively inhibits void formation, diminishes dimples, and eliminates nodules. The approach involves initial electroplating of copper at a high current density, followed by a controlled pause before resuming at a lower current density to fill through-holes efficiently.

Career Highlights

Throughout her career, Joanna has contributed to leading companies in the electronics materials sector. Notably, she has worked with Rohm & Haas Electronic Materials and Dow Global Technologies, where her expertise in electroplating has driven innovative solutions and advancements within the industry.

Collaborations

Joanna Dziewiszek has collaborated with talented individuals like Zuhra I Niazimbetova and Matthew A Thorseth. Their collective efforts have contributed to important developments in electroplating techniques, further establishing their impact on the field.

Conclusion

Joanna Dziewiszek's innovative methodologies in electroplating not only reflect her expertise as an inventor but also showcase her commitment to advancing technology in this critical domain. Her patents, which address common challenges in the electroplating process, continue to influence the electronics manufacturing landscape significantly.