Rohm & Haas Electronic Materials LLC

Dow Global Technolgoies LLC

Synta Pharmaceuticals Corporation

Joanna Dziewiszek

Zuhra I Niazimbetova

Matthew A Thorseth

Mark Lefebvre

Erik Reddington

Yi Qin

Julia Woertink

Lijun Sun

Elena Kostik

Mark Scalisi

Jun Y Choi

Leon Barstad

Nagarajan Jayaraju

Ravi Pokhrel

Rebecca Lea Hazebrouck

James Byrnes

Rebecca Hazebrouck

Niazimbetova Zuhra

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides

Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by a pause in electroplating and then turning on the current to electroplate at a lower current density to fill through-holes.

Method of filling through-holes to reduce voids and other defects

Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good % TIR and % WID balance.

Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of &#x3b1;-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides

At least 70% by weight of Compound 1 is the single crystalline form, Form A, Form C, or Form D, of the compound. A pharmaceutical composition comprises a pharmaceutically acceptable carrier or diluent, and compound 1, wherein at least 70% by weight of the compound is the single crystalline form, Form A, Form C, or Form D, of the compound. A method of treating a subject with cancer comprises administering to the subject an effective amount of compound 1 or the pharmaceutical composition. 

Polymorphs of N-malonyl-bis(N'-methyl-N&#x2032;-thiobenzoylhydrazide)

Growing community of inventors

Boxborough, MA, United States of America

Joanna Dziewiszek