The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Mar. 07, 2017
Applicant:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Inventors:

Matthew Thorseth, Westminster, MA (US);

Rebecca Hazebrouck, Uxbridge, MA (US);

Mark Scalisi, Salem, NH (US);

Zuhra Niazimbetova, Westborough, MA (US);

Joanna Dziewiszek, Boxborough, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 5/02 (2006.01); C25D 7/12 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
C25D 5/022 (2013.01); C25D 3/38 (2013.01); C25D 7/00 (2013.01); C25D 7/123 (2013.01);
Abstract

Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good % TIR and % WID balance.


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