Jinxin Yi

Title: Jinxin Yi - Innovator in Package Substrate Manufacturing

Introduction

Jinxin Yi is a notable inventor based in Guangdong, China. He has made significant contributions to the field of package substrate manufacturing. His innovative methods have paved the way for advancements in electronic packaging technology.

Latest Patents

Jinxin Yi holds a patent for a package substrate manufacturing method. This method includes several intricate steps, such as providing a bearing plate, manufacturing a pattern, and depositing metal to form the first circuit layer. It also involves creating a metal cavity, laminating a dielectric layer, and performing thinning to expose the metal cavity. The process continues with the removal of the bearing plate, etching the metal cavity, and depositing metal on both the cavity and dielectric layer. Finally, it includes forming solder mask layers and cutting the various layers to complete the substrate.

Career Highlights

Throughout his career, Jinxin Yi has worked with prominent companies in the semiconductor industry. He has been associated with Zhuhai Access Semiconductor Co., Ltd and Nexperia B.V. His experience in these organizations has contributed to his expertise in package substrate technology.

Collaborations

Jinxin Yi has collaborated with several professionals in his field, including Xianming Chen and Frank Burmeister. These collaborations have further enhanced his innovative capabilities and contributed to the development of advanced manufacturing techniques.

Conclusion

Jinxin Yi is a distinguished inventor whose work in package substrate manufacturing has made a significant impact on the industry. His innovative methods and collaborations with other professionals highlight his commitment to advancing technology in this field.