Jin Woo Park

Title: Jin Woo Park: Innovator in Semiconductor Packaging

Introduction

Jin Woo Park is a prominent inventor based in Icheon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 7 patents. His innovative designs and methods have advanced the technology used in modern electronics.

Latest Patents

Among his latest patents, Jin Woo Park has developed stack packages that include through mold via structures. This stack package features a first sub-package and a second sub-package stacked on top of each other. The first sub-package contains a first through mold via (TMV) for connection, which is strategically spaced apart from a first semiconductor chip in the X-axis direction. Additionally, it includes a first TMV for bypass, spaced apart from the first semiconductor chip in the Y-axis direction, along with a first redistribution line (RDL) pattern that connects the first semiconductor chip to the first TMV for connection. The second sub-package is designed to include a second TMV for connection, which is also spaced apart from a second semiconductor chip in the Y-axis direction, and another RDL pattern that connects the second semiconductor chip to the second TMV for connection. This innovative design allows the second sub-package to be stacked on the first sub-package, ensuring that the second TMV for connection is effectively connected to the first TMV for bypass.

Another notable patent involves semiconductor packages that relate to a thermal transfer plate and methods of manufacturing the same. This semiconductor package includes a first semiconductor chip positioned on a first surface of an interconnection layer, while a second and a third semiconductor chip are placed on the second surface of the interconnection layer. A thermal transfer plate is strategically positioned between the second and third semiconductor chips, making contact with the second surface of the interconnection layer and overlapping with the first semiconductor chip. This thermal transfer plate is designed to provide an efficient heat radiation path, enhancing the overall performance of the semiconductor package.

Career Highlights

Jin Woo Park has worked with notable companies in the semiconductor industry, including SK Hynix Inc. and Amkor Technology, Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Throughout his career, Jin Woo Park has collaborated with talented individuals such as Bae Yong Kim and Yeon Seung Jung. These collaborations have foster