The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Mar. 31, 2010
Kwang Sun OH, Daejeon, KR;
Dong Hee Lee, Incheon, KR;
Dong IN Kim, Ulsan, KR;
Bae Yong Kim, Jeollanam-do, KR;
Jin Woo Park, Gwanglu, KR;
Kwang Sun Oh, Daejeon, KR;
Dong Hee Lee, Incheon, KR;
Dong In Kim, Ulsan, KR;
Bae Yong Kim, Jeollanam-do, KR;
Jin Woo Park, Gwanglu, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A semiconductor device has a semiconductor die having a first surface and a second surface wherein at least one bond pad is formed on the first surface. A passivation layer is formed on the first surface of the semiconductor device, wherein a central area of the at least one bond is exposed. A seed layer is formed on exposed portions of the bond pad and the passivation layer. A conductive pillar is formed on the seed layer. The conductive pillar has a base portion wherein the base portion has a diameter smaller than the seed layer and a stress relief portion extending from a lateral surface of a lower section of the base portion toward distal ends of the seed layer. A solder layer is formed on the conductive pillar.