IDiyas

For the Inventor, By the Inventor

Hwaseong-si, South Korea

Jin Hyuck Yu

USPTO Granted Patents = 9

Average Co-Inventor Count = 2.2

ph-index = 4

Forward Citations = 62(Granted Patents)


Location History:

  • Hwasung-si, KR (2013)
  • Daejeon, KR (2004 - 2015)
  • Seoul, KR (2000 - 2018)
  • Hwaseong-si, KR (2018)

Company Filing History:

goldMedal5 out of 2,607 
 
Korea Advanced Institute of Science and Technology
 patents
silverMedal4 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2000-2018

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9 patents (USPTO):Explore Patents
1. 10076801 - Semiconductor package and method of manufacturing the same (2018-09-18),
2. 10009030 - Integrated circuit and cable assembly including the same (2018-06-26),
3. 9871524 - Integrated circuit and cable assembly including the same (2018-01-16),
4. 8951306 - Film-type supercapacitor and manufacturing method thereof (2015-02-10),
5. 8373500 - Voltage biasing circuit and data processing system having the same (2013-02-12),
6. 7387910 - Method of bonding solder pads of flip-chip package (2008-06-17),
7. 6902660 - Method of manufacturing printed circuit board and multi-layered PCB (2005-06-07),
8. 6716738 - Method of fabricating multilayered UBM for flip chip interconnections by electroplating (2004-04-06),
9. 6110276 - Method for making n-type semiconductor diamond (2000-08-29),
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