The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
Feb. 27, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/20 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); C01B 31/02 (2006.01); B23K 1/19 (2006.01); B82Y 40/00 (2011.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
B23K 1/203 (2013.01); B23K 1/19 (2013.01); C01B 31/022 (2013.01); H01L 21/4853 (2013.01); H01L 21/4864 (2013.01); H01L 23/4985 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81911 (2013.01); Y10S 977/742 (2013.01); Y10S 977/745 (2013.01); Y10S 977/75 (2013.01); Y10S 977/752 (2013.01); Y10S 977/842 (2013.01); Y10S 977/89 (2013.01); Y10S 977/932 (2013.01);
Abstract
A method of manufacturing a semiconductor package including coating a flux on a connection pad provided on a first surface of a substrate, the flux including carbon nanotubes (CNTs), placing a solder ball on the connection pad coated with the flux, forming a solder layer attached to the connection pad from the solder ball through a reflow process, and mounting a semiconductor chip on the substrate such that the solder layer faces a connection pad in the semiconductor chip may be provided.