Jihwan Suh

Title: Jihwan Suh: Innovator in Semiconductor Technology

Introduction

Jihwan Suh is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on innovative semiconductor packaging solutions that enhance performance and reliability.

Latest Patents

Among his latest patents is a semiconductor package and a method for manufacturing the same. This invention includes a substrate with a first semiconductor chip positioned on it, and a second semiconductor chip placed on top of the first. The design features a first molding layer adjacent to the first semiconductor chip and a second molding layer adjacent to the second semiconductor chip, each made from different materials. The coplanarity of the top surfaces of the first semiconductor chip and the first molding layer is a key aspect of this design, ensuring optimal thermal expansion ratios. Another notable patent is the stacked semiconductor package, which incorporates a protective layer system that enhances the integrity and functionality of the semiconductor chips.

Career Highlights

Jihwan Suh is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His innovative designs have positioned him as a key player in the industry, contributing to advancements that are critical for modern electronic devices.

Collaborations

Throughout his career, Jihwan has collaborated with talented individuals such as Jihwan Hwang and Taehun Kim. These partnerships have fostered a creative environment that has led to groundbreaking innovations in semiconductor packaging.

Conclusion

Jihwan Suh's contributions to semiconductor technology are noteworthy, with a focus on innovative packaging solutions that enhance device performance. His work at Samsung Electronics Co., Ltd. and his collaborations with fellow inventors underscore his impact on the industry.