The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2023
Filed:
Jul. 11, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jihwan Hwang, Hwaseong-si, KR;
Taehun Kim, Asan-si, KR;
Jihwan Suh, Suwon-si, KR;
Soyoun Lee, Hwaseong-si, KR;
Hyuekjae Lee, Hwaseong-si, KR;
Jiseok Hong, Yongin-si, KR;
Abstract
A semiconductor package and a method of forming the same are provided. The semiconductor package includes one or a plurality of chips on a substrate, bumps disposed below each of the one or plurality of chips, an underfill material layer on the substrate, on a side surface of each of the bumps, and extending to side surfaces of the one or plurality of chips, and a mold layer on the substrate and contacting the underfill material layer. The underfill material layer includes a first side portion, a second side portion on the first side portion and having a slope, steeper than a slope of the first side portion, and a third side portion on the second side portion and having a slope that is less steep than a slope of the second side portion.