Jiawen Wang

Title: Innovations by Jiawen Wang in Semiconductor Technology

Introduction

Jiawen Wang is a prominent inventor based in Wuhan, China. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the performance and reliability of semiconductor structures.

Latest Patents

Jiawen Wang's latest patents include innovative methods for forming semiconductor structures. One of his notable inventions is a method that involves a semiconductor structure comprising a first substrate and a bonding layer made of a dielectric material containing carbon (C). The invention specifies that the C atomic concentration of the surface layer of the bonding layer, which is away from the first substrate, is higher than or equal to 35%. This design aims to enhance bonding strength during the bonding process.

Another significant patent by Wang describes a semiconductor structure that includes a first adhesive layer and a first buffer layer, both of which are disposed on the surface of the first substrate. The densities of these layers are greater than that of the first bonding layer. This configuration is designed to improve adhesion and overall performance of the semiconductor structure.

Career Highlights

Jiawen Wang is currently employed at Yangtze Memory Technologies Co., Ltd., where he continues to innovate in the semiconductor field. His work has been instrumental in advancing the technology used in memory devices.

Collaborations

Wang collaborates with notable colleagues, including Xinsheng Wang and Gaosheng Zhang, who contribute to his research and development efforts.

Conclusion

Jiawen Wang's contributions to semiconductor technology through his patents reflect his commitment to innovation and excellence in the field. His work not only enhances the performance of semiconductor structures but also paves the way for future advancements in technology.