Jian Xie

Title: Innovations by Inventor Jian Xie

Introduction

Jian Xie is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. He holds two patents that showcase his expertise in fabricating advanced semiconductor structures. His work has significant implications for the electronics industry, particularly in enhancing the performance and efficiency of semiconductor devices.

Latest Patents

Jian Xie's latest patents include a method of fabricating an air gap and a semiconductor structure. The method of fabricating an air gap involves receiving thickness information of inter-metal and inter-layer dielectric layers formed on a substrate. It includes a two-step etching process to achieve the desired air gap. The semiconductor structure patent describes a semiconductor on insulator (SOI) substrate that features a trap-rich layer and electrically conductive structures, which are integral to an anti-fuse structure.

Career Highlights

Jian Xie is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to develop innovative solutions that address complex challenges in semiconductor fabrication.

Collaborations

Jian collaborates with talented coworkers, including Bo Tao and Li Wang, who contribute to his projects and enhance the overall innovation process within their team.

Conclusion

Jian Xie's contributions to semiconductor technology through his patents and work at United Microelectronics Corporation highlight his role as a significant inventor in the field. His innovative methods and structures are paving the way for advancements in the electronics industry.