Company Filing History:
Years Active: 2015-2016
Title: Innovations of Jia-Jia Chen in Through Silicon Via Technology
Introduction
Jia-Jia Chen is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of through silicon via (TSV) structures and processes. With a total of 3 patents to his name, Chen's work has advanced the capabilities of integrated circuits.
Latest Patents
Chen's latest patents focus on the innovative design and manufacturing processes of through silicon via structures. One of his notable inventions describes a TSV structure located in a recess of a substrate. This structure includes a barrier layer, a buffer layer, and a conductive layer. The barrier layer covers the surface of the recess, while the buffer layer covers the barrier layer. The conductive layer is positioned on the buffer layer and fills the recess, ensuring that the contact surface between the conductive layer and the buffer layer is smoother than that between the buffer layer and the barrier layer. Additionally, he has developed a process for forming this TSV structure.
Career Highlights
Jia-Jia Chen is currently employed at United Microelectronics Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in enhancing the performance and reliability of electronic devices.
Collaborations
Chen has collaborated with notable colleagues such as Chi-Mao Hsu and Tsun-Min Cheng, contributing to various projects that push the boundaries of semiconductor technology.
Conclusion
Jia-Jia Chen's contributions to through silicon via technology exemplify his commitment to innovation in the semiconductor field. His patents reflect a deep understanding of materials and processes that are crucial for the advancement of modern electronics.