IDiyas

For the Inventor, By the Inventor

Boise, ID, United States of America

Jerrold L King

USPTO Granted Patents = 77

Average Co-Inventor Count = 2.3

ph-index = 23

Forward Citations = 2,677(Granted Patents)


Inventors with similar research interests:


Location History:

  • Higley, AZ (US) (2001)
  • Morgan Hill, CA (US) (1999 - 2005)
  • Boise, ID (US) (1992 - 2006)

Company Filing History:

goldMedal76 out of 37,905 
 
Micron Technology Incorporated
 patents
silverMedal1 out of 832,680 
Other
 patents

Years Active: 1992-2006

Loading Chart...
Areas of Expertise:
Semiconductor Packaging
Plastic Lead Frames
Multichip Semiconductor Package
Integrated Circuit Package
Memory Dice
Low Profile Chip Connector
Adhesion Enhanced Die
Redundancy Mapping
Electrical Assembly
Mold Compound Packaging
Alignment Structure
77 patents (USPTO):Explore Patents
1. 7091061 - Method of forming a stack of packaged memory dice (2006-08-15),
2. 7038315 - Semiconductor chip package (2006-05-02),
3. 7005731 - Plastic lead frames for semiconductor devices and packages including same (2006-02-28),
4. 6979889 - Plastic lead frames for semiconductor devices (2005-12-27),
5. 6906409 - Multichip semiconductor package (2005-06-14),
6. 6897553 - Apparatus for forming a stack of packaged memory dice (2005-05-24),
7. 6884654 - Method of forming a stack of packaged memory dice (2005-04-26),
8. 6872600 - Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication (2005-03-29),
9. 6841422 - Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication (2005-01-11),
10. 6836003 - Integrated circuit package alignment feature (2004-12-28),
11. 6787399 - Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication (2004-09-07),
12. 6781848 - Single-piece molded module housing (2004-08-24),
13. 6773955 - Low profile multi-IC chip package connector (2004-08-10),
14. 6762485 - Plastic lead frames for semiconductor devices (2004-07-13),
15. 6740545 - Adhesion enhanced semiconductor die for mold compound packaging (2004-05-25),

Title: The Innovative Journey of Jerrold L King

Introduction: Jerrold L King, a pioneering inventor based in Boise, ID (US), has made significant contributions to the field of technology through his inventive spirit and dedication to innovation.

Latest Patents: Jerrold L King's latest patents showcase his forward-thinking approach to problem-solving and technological advancement. His recent inventions have focused on improving efficiency in renewable energy systems and enhancing user experience in the realm of smart home devices.

Career Highlights: With a career spanning over two decades, Jerrold L King has established himself as a prominent figure in the world of inventors. His groundbreaking work has earned him recognition for pushing the boundaries of what is possible in various industries, from telecommunications to sustainable energy solutions.

Collaborations: Throughout his career, Jerrold L King has collaborated with leading research institutions, universities, and tech companies to bring his innovative ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful development and commercialization of cutting-edge technologies.

Conclusion: Jerrold L King's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors. His impact on the world of technology is undeniable, and his legacy will undoubtedly endure for years to come.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…