Micron Technology Incorporated

Other

Jerrold L King

Jerry Michael Brooks

Walter L Moden

Tongbi T Jiang

J Mike Brooks

David J Corisis

Warren M Farnworth

Leland R Nevill

Larry Duane Kinsman

Kevin H Schofield

Daniel Cram

Tracy V Reynolds

Michael R Slaughter

Rich Fogal

George P McGill

Syed Sajid Ahmad

Chender Huang

Scott Clifford

Ed A Shrock

A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a printed circuit board (PCB). One or more multiconductor insulating assemblies provide an interface between terminals of the integrated circuit semiconductor devices and external circuitry.

Method of forming a stack of packaged memory dice

A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating material and electrode bumps are formed through the encapsulating material to contact the conductive leads. The electrode bumps protrude from the encapsulating material for connection to an external circuit.

Semiconductor chip package

A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.

Plastic lead frames for semiconductor devices and packages including same

A conductive plastic lead frame and method of manufacturing the same, suitable for use in IC packaging, circuit card, electronic device, and a computer system. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.

Plastic lead frames for semiconductor devices

A multichip semiconductor package and method of making is provided that has a plurality of semiconductor chips fabricated in electrical isolation one from another integrally on a singular coextensive substrate useful for numerous and varied semiconductor chip applications. The semiconductor chips, instead of being singulated into a plurality of single-chip packages, are kept as integrally formed together and are thereafter electrically connected together so as to form a larger circuit. Encapsulation follows so as to form a single, multichip package. Common signals of the plurality of semiconductor chips are bussed together in electrical common across the substrate to a common electrode suitable for electrically providing the signal to another, external circuit, such as a PWB. The common bussing is achieved by conductive leads disposed across the substrate in pair sets having an extended portion that accommodates the common electrode in contact therewith. The common electrode contacts the conductive lead through an opening formed in the encapsulant that surrounds the substrate. The extended portions of each conductive lead are staggered with respect to the extended portion of the conductive lead in the same, or juxtaposed, pair set. In this manner, multiple electrodes are available for close proximity positioning while, simultaneously, avoiding electrical shorts amongst the pair sets.

Multichip semiconductor package

Apparatus for forming a stack of packaged memory dice

Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication

An integrated circuit is provided having an alignment feature integral with the lead frame. The integrated circuit includes a lead frame coupled with a semiconductor die, and is partially encapsulated in insulating material. The lead frame has the alignment feature therein. The alignment feature includes a cut out on the lead frame taking the form of a semicircle, protuberance, apertures, or slots. Alternatively, the alignment feature includes a removably coupled tab. After testing of the integrated circuit has been completed, the alignment tab is removed from the integrated circuit. The alignment feature can also be provided on a heat spreader which is attached to a side of or within the lead frame package.

Integrated circuit package alignment feature

An adapter or housing for a module, such as a single in-line memory module (SIMM) or the like, and method of using the same are herein disclosed where the SIMM and attached housing fit a predetermined shape SIMM socket. The housing replaces SIMM board material that would otherwise be used to help secure the SIMM to a predetermined shape SIMM socket or connector. The configuration of the housing allows a SIMM or the like to be snapped or slid and secured into the housing. If desired, an adhesive, potting material and other bonding material can be used to secure the SIMM board to the housing and/or pot the SIMM within the housing.

Single-piece molded module housing

A low profile multi-IC chip package for high-speed applications comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with buses formed on one side. In another embodiment, the connector comprises multiple buses formed from conductive polymer. In further embodiments, the primary packages are stacked within a cage and have their outer leads in unattached contact with buses within the cage or, alternatively, are directly fixed to leads or pads on the host circuit board.

Low profile multi-IC chip package connector

A conductive plastic lead frame and method of manufacturing, the same suitable for use in IC packaging. In a preferred embodiment, the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment, the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.

A semiconductor die includes a metal layer deposited thereon for enhancing adhesion between the die and a mold compound package. The metal layer is substantially oxide free. The die is coated with a layer or layers of copper (Cu) and/or palladium (Pd) by electroplating or electroless coating techniques. The metal layer provides a uniform wetting surface for better adhesion of the die with the mold compound packaging during encapsulation. The increased adhesion reduces the delamination potential of the die from the package.

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Boise, ID, United States of America

Jerrold L King