Hsinchu, Taiwan

Jer-Shien Yang

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.3

ph-index = 1


Company Filing History:


Years Active: 2015-2022

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Jer-Shien Yang: Innovator in Semiconductor Technology

Introduction

Jer-Shien Yang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His innovative work has had a considerable impact on the industry, particularly in the design and operation of semiconductor structures.

Latest Patents

One of Jer-Shien Yang's latest patents is titled "Slit door assembly and method of operating the same." This invention features a slit door assembly that includes a door plate, a supporting arm, and a linkage unit. The method of operating this assembly involves applying a force to move the door plate between two positions. Another notable patent is for a "semiconductor structure and method for manufacturing the same." This patent describes a semiconductor structure that includes a substrate, dielectric layer, buffer layer, and conductors, with a specific focus on the etching process used to create recesses in the substrate.

Career Highlights

Jer-Shien Yang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to develop and refine his innovative ideas, contributing to advancements in semiconductor technology.

Collaborations

Throughout his career, Jer-Shien Yang has collaborated with notable colleagues, including Yen-Ji Chen and Chien-Hung Lin. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Jer-Shien Yang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to shape the future of semiconductor manufacturing and innovation.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…