Jeng-Jen Li

Title: Innovations of Jeng-Jen Li

Introduction

Jeng-Jen Li is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of package structures, holding a total of 11 patents. His work focuses on innovative methods for fabricating package structures that enhance electronic device performance.

Latest Patents

One of his latest patents is titled "Package structure and the method to fabricate thereof." This invention discloses a package structure made from a combination of a metallic substrate and a lead frame. In one embodiment, a recess is formed in the metallic substrate, and a first conductive element with at least one first I/O terminal is bonded in the recess. A lead frame is then formed on the metallic substrate, comprising multiple electrical connections to connect with the first I/O terminal of the first conductive element. Another embodiment includes a conductive element disposed in the vacancy of the lead frame. The invention also outlines a method for manufacturing this package structure.

Another notable patent is also titled "Package structure and the method to fabricate thereof." This invention describes a package structure made from a combination of a device carrier and a modifiable substrate. In this embodiment, a recess is formed in the device carrier, and a conductive element is placed on the substrate. The substrate is positioned on the device carrier, with the conductive element located in the recess. The conductive pattern in the substrate is electrically connected to the device carrier and the I/O terminals of the first conductive element. This patent also includes a method for manufacturing the package structure, allowing for modifications to the conductive pattern in the substrate.

Career Highlights

Jeng-Jen Li has worked with notable companies such as Cyntec Company and the Industrial Technology Research Institute. His experience in these organizations has contributed to his expertise in developing innovative electronic packaging solutions.

Collaborations

Some of his coworkers include Bau-Ru Lu and Da-Jung Chen, who have collaborated with him on various projects.

Conclusion

Jeng-Jen Li's contributions to the field of package structures demonstrate his innovative spirit and commitment to advancing technology. His patents reflect a deep understanding of electronic device fabrication, making him a significant figure in the industry.