The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2008
Filed:
Sep. 22, 2005
Chun-tiao Liu, Hsinchu, TW;
Da-jung Chen, Taoyuan, TW;
Chun-liang Lin, Tainan, TW;
Jeng-jen LI, Taipei, TW;
Cheng Chieh Hsu, Hsinchu, TW;
Chau Chun Wen, Taoyuan, TW;
Chun-Tiao Liu, Hsinchu, TW;
Da-Jung Chen, Taoyuan, TW;
Chun-Liang Lin, Tainan, TW;
Jeng-Jen Li, Taipei, TW;
Cheng Chieh Hsu, Hsinchu, TW;
Chau Chun Wen, Taoyuan, TW;
Cyntec Co., Ltd., Hsin-Chu, TW;
Abstract
A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.