Chun-Liang Lin

Title: Innovations of Chun-Liang Lin

Introduction

Chun-Liang Lin is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on methods and devices that enhance the efficiency and performance of semiconductor components.

Latest Patents

Among his latest patents is a method for manufacturing a heat dissipation bulk of a semiconductor device. This method involves forming an electrically conductive layer on a temporary substrate, connecting semiconductor chips via metal bumps, and creating a metal substrate that fills the gap between the chips and the conductive layer. Another notable patent is for an embedded metal heat sink for a semiconductor device. This invention features a metal thin layer with embedded semiconductor devices and bonding pads that connect to an outer circuit, enhancing thermal management and electrical connectivity.

Career Highlights

Chun-Liang Lin has worked with esteemed institutions such as National Cheng Kung University and Cyntec Company. His experience in these organizations has allowed him to develop innovative solutions that address critical challenges in semiconductor manufacturing and design.

Collaborations

Chun-Liang Lin has collaborated with notable colleagues, including Yan-Kuin Su and Kuan-Chun Chen. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

Chun-Liang Lin's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative methods and devices continue to shape the future of semiconductor applications.